PS thermal potting adhesive is a kind of low viscosity flame retardant two-component additive organic silicon heat-conducting potting adhesive, which can be cured at room temperature or heated, and has the characteristics of higher temperature, faster curing. This product does not produce any by-products in curing reaction, and can be applied to PC(Poly-carbonate), PP, ABS, PVC and other materials and metal surfaces. It is suitable for heat conduction, insulation, waterproof, sealing and flame retardant of electronic accessories.

Product features:

● Mixed use of two components 1:1, fully deep curing

● High temperature resistance, low shrinkage rate and low expansion rate

●Heat conduction, insulation and good dielectric properties

● Anti-vibration, moisture-proof, anti-corrosion, and protection from environmental damage

● Prevent mechanical damage and have repairable function