Thermal mud

Thermal conductivity: 1~8W/mk

Status: Semi-solid

Function: used for gap filling

Specification packaging; 1kg/ 10kg/25kg

characteristic:

No sedimentation, room temperature storage

Superior high and low temperature resistance, excellent weather resistance

Radiation resistance and excellent dielectric properties

Superior chemical and mechanical stability

Low stress, low modulus thermally conductive products

Has the same plasticity as plasticine and is easy to fit

Product design with large variation in thickness requirements

Application side

power module

Integrated chip

power module

automotive electronics

controller

Telecommunications equipment