With the vigorous rise of the living room-style economy, smart TVs and TV boxes have become the daily standard of households. In order to improve the problem of insufficient space and performance of smart TVs and even traditional TVs, TV boxes have attracted a large number of users in terms of cost performance, hardware configuration, and high degree of replacement.

Many friends think that only computers will pay attention to heat dissipation, but in fact TVs or boxes pay attention to this.

A TV box with good heat dissipation performance can avoid the loss of components inside the box, thereby prolonging the service life. At the same time, it also has a certain impact on the running speed of the box. The overheated internal environment is likely to slow down the running system.

The main heating elements of set-top box products:

Chip, PCB board with pin corners, tuner module (receiving signal)

Application environment of thermally conductive materials:

1. Between the chip and the heat sink

Used between the main IC (about 15*15, 28*28, 25*25, etc.) and the heat sink. Here you can use thermally conductive silicone sheets.

2. Between the PCB board and the bottom case

In addition to being used on ICs with high heat generation, the thermally conductive silicone sheet is also attached under the corresponding PCB board of the IC (some PCB boards have pins under it), and a thermally conductive silicone sheet is attached directly to the casing. At the same time, the pins are inserted into the thermally conductive silicone sheet. This makes it easier to dissipate heat.

3. Between the high-frequency head and the shell

The high-frequency head on the set-top box module (mainly plays the role of receiving signals), and the high-frequency head will also emit heat in the case of extremely high requirements on the function and performance of the set-top box. If the temperature is too high, it will affect the signal of the set-top box and cause signal interference. Therefore, it is also necessary to use heat dissipation between the thermal pad and the casing.